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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
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Type: BOOK - Published: 2011-03-28 - Publisher: Springer Science & Business Media

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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element met
Electromigration in ULSI Interconnections
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Authors: Cher Ming Tan
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Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner
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Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. Howe
Electromigration Modeling at Circuit Layout Level
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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure ra
Semiconductor Process Reliability in Practice
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Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detail