Related Books
Language: en
Pages: 974
Pages: 974
Type: BOOK - Published: 2016-11-18 - Publisher: Springer
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
Language: en
Pages: 513
Pages: 513
Type: BOOK - Published: 2021-05-17 - Publisher: Springer Nature
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Language: en
Pages: 633
Pages: 633
Type: BOOK - Published: 2011-01-05 - Publisher: Springer Science & Business Media
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in
Language: en
Pages: 305
Pages: 305
Type: BOOK - Published: 2018-11-05 - Publisher: Springer
This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respectiv
Language: en
Pages: 562
Pages: 562
Type: BOOK - Published: 2013-03-20 - Publisher: Springer Science & Business Media
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro