Related Books
Language: en
Pages:
Pages:
Type: BOOK - Published: 2001 - Publisher:
Language: en
Pages:
Pages:
Type: BOOK - Published: 2001 - Publisher:
Language: en
Pages: 498
Pages: 498
Type: BOOK - Published: 2000 - Publisher:
Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging;
Language: en
Pages: 518
Pages: 518
Type: BOOK - Published: 2001 - Publisher:
Language: en
Pages: 2036
Pages: 2036
Type: BOOK - Published: 2001 - Publisher:
This three-volume set of the proceedings of the July 2001 conference presents information from both academia and industry on advances in electronic packaging. V