Semiconductor Advanced Packaging

Semiconductor Advanced Packaging
Author :
Publisher : Springer Nature
Total Pages : 513
Release :
ISBN-10 : 9789811613760
ISBN-13 : 9811613761
Rating : 4/5 (60 Downloads)

Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.


Semiconductor Advanced Packaging Related Books

Semiconductor Advanced Packaging
Language: en
Pages: 513
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2021-05-17 - Publisher: Springer Nature

DOWNLOAD EBOOK

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Materials for Advanced Packaging
Language: en
Pages: 974
Authors: Daniel Lu
Categories: Technology & Engineering
Type: BOOK - Published: 2016-11-18 - Publisher: Springer

DOWNLOAD EBOOK

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
Advanced Packaging
Language: en
Pages: 28
Authors:
Categories:
Type: BOOK - Published: 2009-01 - Publisher:

DOWNLOAD EBOOK

Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing
Advanced Flip Chip Packaging
Language: en
Pages: 562
Authors: Ho-Ming Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2013-03-20 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Language: en
Pages: 324
Authors: Beth Keser
Categories: Technology & Engineering
Type: BOOK - Published: 2021-12-29 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi