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Flip Chip Technologies
Language: en
Pages: 600
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 1996 - Publisher: McGraw-Hill Professional Publishing

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A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and
Advanced Flip Chip Packaging
Language: en
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Authors: Ho-Ming Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2013-03-20 - Publisher: Springer Science & Business Media

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro
Low Cost Flip Chip Technologies
Language: en
Pages: 616
Authors: John H. Lau
Categories: Business & Economics
Type: BOOK - Published: 2000 - Publisher: McGraw-Hill Professional Publishing

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Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distributi
Flip-Chip Technologies and Global Markets
Language: en
Pages:
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Type: BOOK - Published: 2013-12 - Publisher:

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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Language: en
Pages: 515
Authors: John H. Lau
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Type: BOOK - Published: - Publisher: Springer Nature

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