International Symposium on Electronic Materials and Packaging
Author | : |
Publisher | : |
Total Pages | : 498 |
Release | : 2000 |
ISBN-10 | : UOM:39015051556382 |
ISBN-13 | : |
Rating | : 4/5 (82 Downloads) |
Book Synopsis International Symposium on Electronic Materials and Packaging by :
Download or read book International Symposium on Electronic Materials and Packaging written by and published by . This book was released on 2000 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.