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Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
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Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such di
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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration
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Particularly in the humanities and social sciences, festschrifts are a popular forum for discussion. The IJBF provides quick and easy general access to these im
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
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Pages: 636
Authors: U. Gösele
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Type: BOOK - Published: 1998 - Publisher: The Electrochemical Society

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