3D Stacked Memory

3D Stacked Memory
Author :
Publisher : LexInnova Technologies, LLC
Total Pages : 24
Release :
ISBN-10 :
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis 3D Stacked Memory by :

Download or read book 3D Stacked Memory written by and published by LexInnova Technologies, LLC. This book was released on 2015-04-01 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: Our report on 3D stacked memory technology covers the Intellectual Property (Patent) landscape of this rapidly evolving technology and monitors its various sub-domains for licensing activity. We have analyzed the IP portfolios of SanDisk, Micron, Samsung, IBM and other major players to find the focus areas of their patenting efforts. Using our proprietary patent analytics tool, LexScoreâ„¢, we identify the front runners in this technology domain with strong patent portfolio quality as well as a heavy patent filing activity. Using our proprietary Licensing Heat-map framework, we also predict licensing activity trend in various technology sub domains.


3D Stacked Memory Related Books

3D Stacked Memory
Language: en
Pages: 24
Authors:
Categories:
Type: BOOK - Published: 2015-04-01 - Publisher: LexInnova Technologies, LLC

DOWNLOAD EBOOK

Our report on 3D stacked memory technology covers the Intellectual Property (Patent) landscape of this rapidly evolving technology and monitors its various sub-
Handbook of 3D Integration, Volume 4
Language: en
Pages: 655
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Language: en
Pages:
Vertical 3D Memory Technologies
Language: en
Pages: 0
Authors: Betty Prince
Categories: Technology & Engineering
Type: BOOK - Published: 2014-10-06 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory bl
3D Stacked Chips
Language: en
Pages: 354
Authors: Ibrahim (Abe) M. Elfadel
Categories: Technology & Engineering
Type: BOOK - Published: 2016-05-11 - Publisher: Springer

DOWNLOAD EBOOK

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices th