Advanced Polyimide Materials

Advanced Polyimide Materials
Author :
Publisher : Elsevier
Total Pages : 499
Release :
ISBN-10 : 9780128126417
ISBN-13 : 0128126418
Rating : 4/5 (17 Downloads)

Book Synopsis Advanced Polyimide Materials by : Shi-Yong Yang

Download or read book Advanced Polyimide Materials written by Shi-Yong Yang and published by Elsevier. This book was released on 2018-04-20 with total page 499 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared


Advanced Polyimide Materials Related Books

Advanced Polyimide Materials
Language: en
Pages: 499
Authors: Shi-Yong Yang
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-20 - Publisher: Elsevier

DOWNLOAD EBOOK

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials.
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Language: en
Pages: 576
Authors: Beth Keser
Categories: Technology & Engineering
Type: BOOK - Published: 2019-02-12 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and mate
Fillers and Reinforcements for Advanced Nanocomposites
Language: en
Pages: 587
Authors: Yu Dong
Categories: Technology & Engineering
Type: BOOK - Published: 2015-07-02 - Publisher: Woodhead Publishing

DOWNLOAD EBOOK

Fillers and Reinforcements for Advanced Nanocomposites reviews cutting-edge, state-of-the-art research on the effective use of nanoscaled fillers and reinforcem
Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications
Language: en
Pages: 376
Authors: Nithin Kundachira Subramani
Categories: Technology & Engineering
Type: BOOK - Published: 2021-05-28 - Publisher: Elsevier

DOWNLOAD EBOOK

Polymer-Based Advanced Functional Composites for Optoelectronic and Energy Applications explains how polymer-based smart composites and nanocomposites can be pr
High Performance Polymers - Polyimides Based
Language: en
Pages: 260
Authors: Marc Abadie
Categories: Science
Type: BOOK - Published: 2012-12-19 - Publisher: BoD – Books on Demand

DOWNLOAD EBOOK

The feature of polyimides and other heterocyclic polymers are now well-established and used for long term temperature durability in the range of 250 - 350'C. Th